Engineering
Micro Memory Bank's engineering provides custom design on most desired memory modules. We can be very aggressive with design parameters; basically if it can be fabricated at the PCB house then we can design it. Our vertical process include: layout, PCB fabrication, test adopter build (if necessary), parts procurement, prototype build and a final production lot release. Designs and production releases include a bill-of-material, assembly, PCB fabrication and optional SPD drawings.

Layout Guidelines
Number of Layers: 1. Component & Solder Side
2. Inner Power & Ground Layers
3. Unlimited number of layers, based on technical specifications and requirements

Board Size (max.): 32 x 32 inches.

Design Guidelines:
1. Standard trace width: 0.006"; advanced: 0.003"
2. Standard spacing width: 0.006"; advanced: 0.004"
3. Standard hole (min.) e.g. 0.050"thick board: 0.012"; advanced: 0.008"
4. Standard pad size (min.): 0.026"; advanced 0.016

Special Expertise:
Extensive experience with memory modules and test-load boards.
Flash memory high-speed modular sub-system designs

Design Software:
1. Layout: ORCAD and PowerPCB (formally PADs)
2. Support spec sheets: ORCAD and AutoCAD
3. Hyperlynx's Simulation Signal Integrity Tools for EMC FCC approval.

Typical Lead times: One week.